Chie Mei AVM-67C automatic blister packing machine for USB and memory cards. Thermoforming, film sealing, and punching capabilities. Taiwan-made with CE certification.
This “Automatic blister packaging machine” is used for the packaging of USB and memory cards. The outer dimensions of the two packages are same, so the mold can be replaced to package different products. Machine running steps: form the tray → product feeding → film sealing → punching hanging hole → cutting → products outlet
The AVM-67C's quick-change mold system eliminates extended setup periods between product runs. With identical outer dimensions for different products, you can swap molds in minutes rather than hours, maximizing production uptime and reducing per-unit packaging costs while maintaining consistent blister quality across all SKUs.
Manufactured in Taiwan with ISO 9001 and CE certifications, the AVM-67C represents Chie Mei's 55 years of packaging machinery expertise. This blister packaging machine reduces material waste through precise thermoforming and film sealing, supporting both operational efficiency and environmental responsibility. With comprehensive after-sales support including technical consultation and maintenance guidance, Chie Mei ensures your packaging operation runs continuously at peak performance, delivering reliable solutions for electronics manufacturers and packaging suppliers across Asia and internationally.